US 11,870,124 B2
Balance-unbalance conversion apparatus, communications device, and communications system
Dajun Zang, Dongguan (CN); Cuicui Wang, Beijing (CN); Daochun Mo, Shenzhen (CN); Yuchun Lu, Beijing (CN); and Linchun Wang, Beijing (CN)
Assigned to Huawei Technologies Co., Ltd., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Apr. 29, 2021, as Appl. No. 17/244,741.
Application 17/244,741 is a continuation of application No. PCT/CN2019/112784, filed on Oct. 23, 2019.
Claims priority of application No. 201811299393.5 (CN), filed on Oct. 31, 2018.
Prior Publication US 2021/0249747 A1, Aug. 12, 2021
Int. Cl. H01P 5/10 (2006.01); H01P 3/08 (2006.01); H03H 7/42 (2006.01); H04B 3/54 (2006.01)
CPC H01P 5/10 (2013.01) [H01P 3/08 (2013.01); H03H 7/42 (2013.01); H04B 3/54 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A balance-unbalance conversion apparatus, comprising:
an insulation substrate;
a first microstrip, wherein:
the first microstrip comprises a first balance signal connecting section, a first impedance matching section, and an unbalance signal connecting section that are sequentially connected, wherein the first balance signal connecting section is configured to transmit a first component of a balance signal, and the unbalance signal connecting section is configured to transmit an unbalance signal;
a second microstrip, wherein:
the second microstrip comprises a second balance signal connecting section, a second impedance matching section, and a ground section that are sequentially connected, wherein the second balance signal connecting section is configured to transmit a second component of the balance signal, and the ground section is configured to connect to a ground signal; and
a conductive ground, wherein:
the conductive ground is a reference ground of the first balance signal connecting section and the second balance signal connecting section, and the conductive ground is located relatively closer to the second impedance matching section than to the ground section,
wherein:
the first microstrip, the second microstrip, and the conductive ground are all disposed on the insulation substrate, the first balance signal connecting section and the second balance signal connecting section are located on a same plane of the insulation substrate, and the first impedance matching section of the first microstrip and the second impedance matching section of the second microstrip are separated by the insulation substrate; and
a cross-sectional area of at least one of a part of the first microstrip or a part of the second microstrip has a gradient.