US 11,869,925 B2
3D printed semiconductor package
Benjamin Stassen Cook, Los Gatos, CA (US); and Daniel Lee Revier, Garland, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Feb. 1, 2021, as Appl. No. 17/163,766.
Application 17/163,766 is a division of application No. 16/236,106, filed on Dec. 28, 2018, granted, now 10,910,465.
Prior Publication US 2021/0151551 A1, May 20, 2021
Int. Cl. H01L 21/56 (2006.01); H01L 49/02 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01)
CPC H01L 28/10 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/66 (2013.01); H01L 2223/6677 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method comprising:
immersing a substrate including at semiconductor die attached thereon in a liquid polymer material:
irradiating part of the liquid polymer material to polymerize and to form a three- dimensional polymer structure on the substrate;
coating the three-dimensional polymer structure with a metal to form a device;
electrically connecting the device with the semiconductor die; and
forming an integrated circuit by encapsulating the semiconductor die and the three- dimensional polymer structure in a package.