US 11,869,908 B2
Photosensitive chip package structure, camera module, and mobile terminal
Atsushi Yajima, Shenzhen (CN); Kun Ran, Dongguan (CN); Zhendong Luo, Shenzhen (CN); Lifeng Fu, Dongguan (CN); Weichih Lin, Dongguan (CN); and Changfu Huang, Dongguan (CN)
Assigned to Honor Device Co., Ltd., Shenzhen (CN)
Appl. No. 17/266,057
Filed by Honor Device Co., Ltd., Guangdong (CN)
PCT Filed Aug. 27, 2018, PCT No. PCT/CN2018/102540
§ 371(c)(1), (2) Date Feb. 4, 2021,
PCT Pub. No. WO2020/041942, PCT Pub. Date Mar. 5, 2020.
Prior Publication US 2021/0313366 A1, Oct. 7, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14618 (2013.01) [H01L 27/14625 (2013.01); H01L 27/14636 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A photosensitive chip package structure, comprising a substrate and a photosensitive chip mounted on the substrate, wherein a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate using a metal wire; and further comprising:
a frame, disposed on the side of the photosensitive chip away from the substrate, wherein an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, wherein the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and
a filling glue, filled in the avoidance groove, wrapping around the metal wire and bonding the frame to the non-photosensitive area of the photosensitive chip and the substrate.