US 11,869,904 B2
Array substrate, method for fabricating same, and display device
Xiaobo Hu, Guangdong (CN)
Assigned to SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD., Guangdong (CN)
Appl. No. 17/048,819
Filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Guangdong (CN)
PCT Filed Aug. 5, 2020, PCT No. PCT/CN2020/107079
§ 371(c)(1), (2) Date Oct. 19, 2020,
PCT Pub. No. WO2022/016618, PCT Pub. Date Jan. 27, 2022.
Claims priority of application No. 202010697170.5 (CN), filed on Jul. 20, 2020.
Prior Publication US 2023/0163146 A1, May 25, 2023
Int. Cl. H01L 27/12 (2006.01); H01L 25/16 (2023.01); H01L 23/00 (2006.01)
CPC H01L 27/1288 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 25/167 (2013.01); H01L 27/1248 (2013.01); H01L 24/08 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/08145 (2013.01); H01L 2924/12041 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for fabricating an array substrate, comprising:
providing a substrate;
forming an array layer on the substrate; wherein the array layer comprises a thin film transistor and a conductive pad spaced apart in a direction parallel to the substrate;
forming a passivation layer on the array layer, wherein the passivation layer covers the thin film transistor and the conductive pad;
forming a full-surface carbon film on the passivation layer; and
removing the passivation layer and the carbon film corresponding to the conductive pad by a patterning process to obtain the array substrate;
wherein the step of removing the passivation layer and the carbon film corresponding to the conductive pad by the patterning process comprises:
forming a photoresist layer on a surface of the carbon film away from the passivation layer;
patterning the photoresist layer to obtain a patterned photoresist layer with an opening corresponding to the conductive pad;
sequentially removing part of the carbon film and part of the passivation layer corresponding to the opening to expose the conductive pad; wherein the carbon film forms a patterned carbon film covering the thin film transistor, and the patterned carbon film is a light-shielding layer.