US 11,869,897 B2
Array substrate, display apparatus, and method of fabricating array substrate
Ke Wang, Beijing (CN); Muxin Di, Beijing (CN); Zhiwei Liang, Beijing (CN); Guoqiang Wang, Beijing (CN); Renquan Gu, Beijing (CN); Xiaoxin Song, Beijing (CN); Xiaoyan Zhu, Beijing (CN); Yingwei Liu, Beijing (CN); and Zhanfeng Cao, Beijing (CN)
Assigned to BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 17/057,546
Filed by BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Mar. 24, 2020, PCT No. PCT/CN2020/080810
§ 371(c)(1), (2) Date Nov. 20, 2020,
PCT Pub. No. WO2021/189230, PCT Pub. Date Sep. 30, 2021.
Prior Publication US 2022/0199650 A1, Jun. 23, 2022
Int. Cl. H01L 27/12 (2006.01)
CPC H01L 27/124 (2013.01) [H01L 27/127 (2013.01); H01L 27/1251 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An array substrate, comprising a display area having a plurality of subpixels;
wherein the display area comprises a regular display sub-area and a display-bonding sub-area;
the plurality of subpixels comprises a plurality of first subpixels in the display-bonding sub-area and a plurality of second subpixels in the regular display sub-area;
wherein the array substrate comprises:
a base substrate extending throughout the regular display sub-area and the display-bonding sub-area; and
a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels;
wherein a respective one of the plurality of first subpixels comprises:
a bonding pad on a second side of the base substrate, wherein the second side is opposite to the first side;
a lead line electrically connecting a respective one of the plurality of thin film transistors to the bonding pad, wherein the lead line is unexposed in the array substrate; and
a via extending through the base substrate;
wherein the lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.