US 11,869,879 B2
Semiconductor package using a coreless signal distribution structure
Do Hyung Kim, Gyeonggi-do (KR); Jung Soo Park, Gyeonggi-do (KR); and Seung Chul Han, Gyeonggi-do (KR)
Assigned to AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Oct. 13, 2022, as Appl. No. 17/965,530.
Application 17/965,530 is a continuation of application No. 17/156,788, filed on Jan. 25, 2021, granted, now 11,476,233.
Application 17/156,788 is a continuation of application No. 15/689,714, filed on Aug. 29, 2017, granted, now 10,903,190, issued on Jan. 26, 2021.
Application 15/689,714 is a continuation of application No. 15/018,668, filed on Feb. 8, 2016, granted, now 9,780,074, issued on Oct. 3, 2017.
Claims priority of application No. 10-2015-0019458 (KR), filed on Feb. 9, 2015.
Prior Publication US 2023/0103298 A1, Apr. 6, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/10 (2006.01); H01L 21/48 (2006.01); H01L 23/544 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/4867 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3157 (2013.01); H01L 23/3185 (2013.01); H01L 23/3192 (2013.01); H01L 23/49811 (2013.01); H01L 23/538 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/00 (2013.01); H01L 24/12 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/544 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06524 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/18161 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a signal distribution structure comprising a signal distribution structure top side, a signal distribution structure bottom side, a signal distribution structure lateral side between the signal distribution structure top side and the signal distribution structure bottom side, top side first conductive portions and top side second conductive portions along the signal distribution structure top side, and bottom side conductive portions along the signal distribution structure bottom side;
a first semiconductor die comprising a first die top side, a first die bottom side, and a first die lateral side between the first die top side and the first die bottom side, wherein the first die bottom side is coupled to the top side first conductive portions of the signal distribution structure;
a second semiconductor die comprising a second die top side, a second die bottom side, and a second die lateral side between the second die top side and the second die bottom side, wherein the second die bottom side is coupled to the top side second conductive portions of the signal distribution structure top side;
an electrical component comprising a component top side, a component bottom side, and a component lateral side between the component top side and the component bottom side, wherein the component top side is coupled to the signal distribution structure bottom side and bridges between the first semiconductor die and the second semiconductor die;
a metal post comprising a metal post top side and a metal post bottom side, wherein the metal post top side is coupled to the the signal distribution structure bottom side; and
a first encapsulant encapsulating the first die lateral side.