US 11,869,878 B2
Semiconductor module including a semiconductor package connected to a module substrate and a bonding wire
Kyungseon Hwang, Suwon-si (KR); Wonyoung Kim, Suwon-si (KR); and Jinchan Ahn, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 5, 2021, as Appl. No. 17/453,725.
Application 17/453,725 is a continuation of application No. 16/695,971, filed on Nov. 26, 2019, granted, now 11,171,119.
Claims priority of application No. 10-2019-0058312 (KR), filed on May 17, 2019.
Prior Publication US 2022/0059506 A1, Feb. 24, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/3142 (2013.01); H01L 23/49816 (2013.01); H01L 24/29 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a module substrate comprising a top electrode pad;
a first adhesive member disposed on the module substrate;
a semiconductor package mounted on the module substrate via the first adhesive member;
a first connection member connecting the module substrate to the semiconductor package; and
a first molding member covering the first connection member,
wherein the semiconductor package comprises:
a package substrate comprising a connection pad and a test pad;
a semiconductor chip mounted on the package substrate in a flip chip manner;
a second connection member connecting the package substrate to the semiconductor chip; and
a second molding member covering the semiconductor chip, and
wherein the first connection member connects the top electrode pad to the test pad;
wherein the first adhesive member is adhered to a top surface of the module substrate and to a bottom surface of the semiconductor package; and
wherein a portion of a top surface of the test pad of the package substrate is covered by the first molding member, and a remaining portion of the top surface of the test pad is covered by the second molding member.