US 11,869,865 B2
Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
Thomas Bemmerl, Schwandorf (DE); Chooi Mei Chong, Melaka (MY); Edward Myers, Unterhaching (DE); and Michael Stadler, Munich (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jul. 30, 2021, as Appl. No. 17/389,721.
Application 17/389,721 is a continuation of application No. 16/695,866, filed on Nov. 26, 2019, granted, now 11,088,105.
Claims priority of application No. 102018130147.2 (DE), filed on Nov. 28, 2018.
Prior Publication US 2021/0358877 A1, Nov. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/37 (2013.01) [H01L 24/84 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/84345 (2013.01); H01L 2224/84815 (2013.01); H01L 2924/3656 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a carrier comprising a die pad and a contact;
a semiconductor die comprising a first main side and an opposing second main side, the semiconductor die being attached to the die pad by a first solder joint such that the second main side faces the die pad; and
a contact clip comprising a first contact region and a second contact region, the first contact region being attached to the first main side of the semiconductor die by a second solder joint and the second contact region being attached to the contact by a third solder joint,
wherein the first contact region has a convex shape facing towards the first main side of the semiconductor die such that a distance between the first main side and the first contact region increases from a base of the convex region towards an edge of the first contact region,
wherein the base runs along a line that runs substantially perpendicular to a longitudinal axis of the contact clip.