CPC H01L 24/13 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1434 (2013.01)] | 17 Claims |
1. A microelectronic component, comprising:
at least one bond pad on a substrate surface; and
a metal pillar structure secured to the at least one bond pad, the metal pillar structure comprising:
a metal tube; and
a solder material substantially filling and protruding from the metal tube.
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