US 11,869,862 B2
Microelectronic components including metal pillars secured to bond pads, and related methods, assemblies, and systems
Shams U. Arifeen, Boise, ID (US); Christopher Glancey, Boise, ID (US); and Koustav Sinha, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Mar. 4, 2022, as Appl. No. 17/653,610.
Application 17/653,610 is a continuation of application No. 16/804,413, filed on Feb. 28, 2020, granted, now 11,276,659.
Prior Publication US 2022/0189899 A1, Jun. 16, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/81 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/1434 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A microelectronic component, comprising:
at least one bond pad on a substrate surface; and
a metal pillar structure secured to the at least one bond pad, the metal pillar structure comprising:
a metal tube; and
a solder material substantially filling and protruding from the metal tube.