US 11,869,834 B2
Electroconductive substrate, electronic device and display device
Takashi Daitoku, Tokyo (JP); Susumu Taniguchi, Tokyo (JP); Akiko Seki, Tokyo (JP); Atsushi Sato, Tokyo (JP); Yuhei Horikawa, Tokyo (JP); Makoto Orikasa, Tokyo (JP); and Hisayuki Abe, Tokyo (JP)
Assigned to TDK CORPORATION, Tokyo (JP)
Filed by TDK CORPORATION, Tokyo (JP)
Filed on May 7, 2021, as Appl. No. 17/314,187.
Application 17/314,187 is a continuation of application No. 16/811,018, filed on Mar. 6, 2020, granted, now 11,031,330.
Application 16/811,018 is a continuation of application No. 16/038,491, filed on Jul. 18, 2018, granted, now 10,867,898, issued on Dec. 15, 2020.
Claims priority of application No. 2017-146672 (JP), filed on Jul. 28, 2017.
Prior Publication US 2021/0265256 A1, Aug. 26, 2021
Int. Cl. H01L 23/498 (2006.01); H01L 33/62 (2010.01); H05K 1/09 (2006.01); H01L 21/48 (2006.01); H05K 3/40 (2006.01); G06F 3/044 (2006.01)
CPC H01L 23/49838 (2013.01) [G06F 3/044 (2013.01); H01L 21/4857 (2013.01); H01L 23/49866 (2013.01); H01L 33/62 (2013.01); H05K 1/09 (2013.01); H05K 3/4007 (2013.01); H01L 2933/0066 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0341 (2013.01); H05K 2203/04 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An electroconductive substrate comprising:
a base material;
a trench formation layer on one side of the base material; and
an electroconductive pattern layer, wherein:
the trench formation layer includes a trench with (i) a bottom surface facing the base material and (ii) a first inclined lateral surface that is inclined from the bottom surface outwardly;
the trench is at least partially filled with the electroconductive pattern layer;
the electroconductive pattern layer in the trench has a second inclined lateral surface facing the first inclined lateral surface and inclined in a same direction as the first inclined lateral surface; and
there is a gap between the first inclined lateral surface and the second inclined lateral surface.