US 11,869,823 B2
System in a package modifications
Michael Kenneth Conti, Dallas, TX (US); Christopher Lloyd Reinert, Frisco, TX (US); and Masood Murtuza, Sugar Land, TX (US)
Assigned to OCTAVO SYSTEMS LLC, Sugar Land, TX (US)
Filed by Octavo Systems LLC, Sugar Land, TX (US)
Filed on Nov. 6, 2020, as Appl. No. 17/091,371.
Claims priority of provisional application 62/932,976, filed on Nov. 8, 2019.
Prior Publication US 2021/0143075 A1, May 13, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 23/32 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/32 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A System in a Package (SiP) device, comprising:
a substrate;
a plurality of connectors disposed on a top surface of the substrate;
one or more conductive pads disposed on the top surface of the substrate and operatively interconnected with one or more of the plurality of connectors; and
a plurality of components mounted on the plurality of connectors on the top surface of the substrate and operatively interconnected with the plurality of connectors respectively, wherein
the plurality of connectors is disposed between the plurality of components and the top surface of the substrate respectively,
the plurality of components and the plurality of connectors are encapsulated in a packaging of the SiP device, and
the one or more conductive pads are wholly located outside the packaging of the SiP device.