US 11,869,820 B2
IC having a metal ring thereon for stress reduction
Amit Sureshkumar Nangia, Murphy, TX (US); Sreenivasan Kalyani Koduri, Dallas, TX (US); Siva Prakash Gurrum, Allen, TX (US); and Christopher Daniel Manack, Flower Mound, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Jul. 1, 2022, as Appl. No. 17/810,568.
Application 17/810,568 is a division of application No. 16/859,530, filed on Apr. 27, 2020, granted, now 11,387,155.
Claims priority of provisional application 62/947,068, filed on Dec. 12, 2019.
Prior Publication US 2022/0336304 A1, Oct. 20, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/16 (2006.01)
CPC H01L 23/16 (2013.01) [H01L 24/97 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/14 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method of fabricating an integrated circuit (IC), comprising:
providing a substrate including circuitry configured for a function including a stress sensitive circuit portion; and
forming a solid same metal wall that is ring-shaped having opposing end surfaces, one of the end surfaces attached to the substrate and the other end surface attached to a metal pad that covers the entire other end surface, wherein the stress sensitive circuit portion is positioned with a least a majority of its area within an inner area of the substrate that is framed by the solid metal wall to provide a cavity.