CPC H01L 23/16 (2013.01) [H01L 24/97 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/14 (2013.01)] | 21 Claims |
1. A method of fabricating an integrated circuit (IC), comprising:
providing a substrate including circuitry configured for a function including a stress sensitive circuit portion; and
forming a solid same metal wall that is ring-shaped having opposing end surfaces, one of the end surfaces attached to the substrate and the other end surface attached to a metal pad that covers the entire other end surface, wherein the stress sensitive circuit portion is positioned with a least a majority of its area within an inner area of the substrate that is framed by the solid metal wall to provide a cavity.
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