US 11,869,816 B2
LED package with multiple test pads and parallel circuit elements
Fu-Bang Chen, Miaoli County (TW); Chih-Chiang Chang, Miaoli County (TW); Chang-Ching Huang, Miaoli County (TW); Chun-Ming Lai, Miaoli County (TW); Wen-Hsing Huang, Miaoli County (TW); Tzeng-Guang Tsai, Miaoli County (TW); and Kuo-Hsin Huang, Miaoli County (TW)
Assigned to EXCELLENCE OPTO. INC., Hsinchu Science Park (TW)
Filed by EXCELLENCE OPTO. INC., Miaoli County (TW)
Filed on Jul. 26, 2021, as Appl. No. 17/385,101.
Prior Publication US 2023/0021896 A1, Jan. 26, 2023
Int. Cl. H01L 21/66 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 29/866 (2006.01); H01L 33/52 (2010.01); H01L 25/16 (2023.01)
CPC H01L 22/32 (2013.01) [H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 29/866 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An LED package with multiple test pads and a parallel element which is used for chip bonding of a main element of LED chip and a parallel circuit secondary element, comprising:
a package substrate, wherein the package substrate is provided with an upper element plane and a lower SMD electrode plane located on two sides, the upper element plane is provided with a first electrode of the main element, a second electrode of the main element, a first electrode of the secondary element, and a second electrode of the secondary element, the first electrode of the main element and the second electrode of the main element are used for chip bonding of the main element of LED chip, the first electrode of the secondary element and the second electrode of the secondary element are used for chip bonding of the parallel circuit secondary element, and the first electrode of the main element is in electrical communication with the first electrode of the secondary element;
a first electrical test contact, wherein the first electrical test contact is disposed on the package substrate and electrically connected to the first electrode of the main element and the first electrode of the secondary element;
a second electrical test contact, wherein the second electrical test contact is disposed on the package substrate and electrically connected to the second electrode of the secondary element; and
a third electrical test contact, wherein the third electrical test contact is disposed on the package substrate and electrically connected to the second electrode of the main element.