US 11,869,815 B2
Asymmetry correction via oriented wafer loading
Eric Lau, Santa Clara, CA (US); Charles C. Garretson, Monterey, CA (US); Huanbo Zhang, San Jose, CA (US); and Zhize Zhu, Cupertino, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 16, 2022, as Appl. No. 17/696,813.
Application 17/696,813 is a division of application No. 16/552,456, filed on Aug. 27, 2019, granted, now 11,282,755.
Prior Publication US 2022/0208621 A1, Jun. 30, 2022
Int. Cl. H01L 21/66 (2006.01); B25J 9/16 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B24B 37/30 (2012.01); B24B 49/12 (2006.01)
CPC H01L 22/26 (2013.01) [B24B 37/30 (2013.01); B24B 49/12 (2013.01); B25J 9/1628 (2013.01); H01L 21/30625 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); H01L 21/68707 (2013.01); H01L 22/20 (2013.01); H01L 22/12 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for chemical mechanical polishing, comprising:
receiving, by a controller of a chemical mechanical polishing (CMP) apparatus, an angular removal profile for a carrier head and an angular thickness profile of a substrate;
prior to polishing the substrate, selecting a desired angle of the carrier head relative to the substrate for loading the substrate into the carrier head, wherein selecting the desired angle is performed based on a comparison of the angular removal profile for the carrier head and the angular thickness profile of the substrate to reduce angular non-uniformity in polishing;
detecting, while the substrate in a measuring position on a metrology station of the CMP apparatus and prior to loading the substrate into the carrier head, an angular orientation of the substrate;
rotating the carrier head to receive the substrate at the desired angle;
transferring, by a predetermined motion of one or more robots of the CMP apparatus that transfer the substrate from an measuring position into the carrier head, the substrate to the carrier head and loading the substrate into the carrier head with the carrier head at the desired angle relative to the substrate;
calculating an absolute angular position of the substrate upon loading into the carrier head, the calculating based on i) the angular orientation of the substrate prior to loading and ii) an amount of rotation from the predetermined motion of the one or more robots; and
polishing the substrate.