US 11,869,813 B2
Planarization apparatus, planarization process, and method of manufacturing an article
Xiaoming Lu, Cedar Park, TX (US)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Dec. 15, 2020, as Appl. No. 17/122,910.
Prior Publication US 2022/0189832 A1, Jun. 16, 2022
Int. Cl. H01L 21/66 (2006.01); H01L 21/67 (2006.01); H01L 21/56 (2006.01)
CPC H01L 22/20 (2013.01) [H01L 21/565 (2013.01); H01L 21/67126 (2013.01); H01L 21/67253 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method of leveling control between a superstrate and a substrate, comprising:
identifying a contact force model indicating a relationship between a total contact force for planarization of a formable material between the superstrate and the substrate and a force component of the total contact force along each of a plurality of peripheral axes; and
determining a set point force required for performing the planarization;
calculating each force component based on the contact force model; and
performing planarization by applying each force component along a corresponding axis of the plurality of peripheral axes;
wherein the contact force model is identified based on a parallel condition between two contacting surfaces of:
a superstrate chuck for retaining the superstrate; and
a stack of the superstrate, the substrate, and formable material between the superstrate and the substrate.