US 11,869,798 B2
Deposition apparatus
Manabu Honma, Iwate (JP); Yudo Sugawara, Iwate (JP); and Noriko Sato, Iwate (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Jan. 21, 2021, as Appl. No. 17/154,065.
Claims priority of application No. 2020-016153 (JP), filed on Feb. 3, 2020.
Prior Publication US 2021/0242070 A1, Aug. 5, 2021
Int. Cl. C23C 16/46 (2006.01); H01L 21/687 (2006.01); C23C 14/50 (2006.01); C23C 14/24 (2006.01); H01L 21/67 (2006.01); C23C 16/455 (2006.01); C23C 16/458 (2006.01)
CPC H01L 21/68785 (2013.01) [C23C 14/24 (2013.01); C23C 14/505 (2013.01); C23C 16/4584 (2013.01); C23C 16/45551 (2013.01); C23C 16/46 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/68771 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A deposition apparatus comprising:
a vacuum vessel;
a rotary table on which a plurality of substrates are placed in a circumferential direction of the rotary table, the rotary table being disposed in the vacuum vessel so as to be rotatable;
a heating device provided below the rotary table, the heating device being configured to heat the plurality of substrates by thermal radiation;
a radiation adjusting member configured to adjust an amount of radiant heat from the heating device to the plurality of substrates; and
a controller,
wherein the radiation adjusting member includes
a rotary plate,
a rotating shaft configured to cause rotation of the rotary plate independently of the rotary table, and
films provided on the rotary plate, the films being configured to adjust respective amounts of the radiant heat to the plurality of substrates,
wherein the controller is configured to:
rotate the rotary table and the rotary plate in different modes, the different modes including
a first rotational mode by which the rotary table and the rotary plate are respectively rotated at a first rotational speed and a second rotational speed such that,
the first rotational speed is matched to the second rotational speed, and
centers of the plurality of substrates are respectively aligned with centers of the films, and
a second rotational mode by which the rotary table and the rotary plate are respectively rotated at a third rotational speed and a fourth rotational speed such that the third rotational speed is not matched to the fourth rotational speed, and
control (i) a first amount of time rotating the rotary table and the rotary plate in the first rotational mode and (ii) a second amount of time rotating the rotary table and the rotary plate in the second rotational mode, to adjust a temperature difference between an outer periphery and a central portion of each substrate.