US 11,868,557 B2
Touch substrate and manufacturing method thereof
Jian Tian, Beijing (CN); Xiaohui Yang, Beijing (CN); Jie Lei, Beijing (CN); Zouming Xu, Beijing (CN); and Xiaofeng Yin, Beijing (CN)
Assigned to Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 17/631,584
Filed by Hefei Xinsheng Optoelectronics Technology Co., Ltd., Anhui (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Apr. 23, 2021, PCT No. PCT/CN2021/089263
§ 371(c)(1), (2) Date Jan. 31, 2022,
PCT Pub. No. WO2021/238530, PCT Pub. Date Dec. 2, 2021.
Claims priority of application No. 202010460605.4 (CN), filed on May 26, 2020.
Prior Publication US 2022/0283688 A1, Sep. 8, 2022
Int. Cl. G06F 3/041 (2006.01)
CPC G06F 3/04164 (2019.05) [G06F 3/0412 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04111 (2013.01); G06F 2203/04112 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A touch substrate, comprising a base substrate and a touch electrode structure in a display area of the base substrate, wherein
the touch substrate further comprises a conductive structure and a wiring structure, wherein the conductive structure is in a peripheral area of the base substrate outside the display area, and comprises at least one conductive layer, and the at least one conductive layer comprises a one-piece layer of a whole layer without any pattern design, which is configured to be intended to form a lead electrically connected to a driving circuit for the touch electrode structure; and
the wiring structure is in a wiring area between the display area and the peripheral area of the base substrate and is configured to electrically connect the conductive structure to the touch electrode structure.