	US 11,868,040 B2
	Method for forming target substrate and electronic device
Chien-Hsing Lee, Miao-Li County (TW); Chin-Lung Ting, Miao-Li County (TW); Jung-Chuan Wang, Miao-Li County (TW); and Hong-Sheng Hsieh, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Feb. 25, 2022, as Appl. No. 17/681,145.
Application 17/681,145 is a division of application No. 16/715,929, filed on Dec. 16, 2019, granted, now 11,294,273.
Claims priority of provisional application 62/925,922, filed on Oct. 25, 2019.
Prior Publication US 2022/0179305 A1, Jun. 9, 2022
Int. Cl. G03F 1/60 (2012.01)

CPC G03F 1/60 (2013.01)

6 Claims

1. A method for forming a target substrate, comprising:

providing a mask substrate, wherein providing the mask substrate comprises:

assembling a first substrate and a patterned substrate; and

cutting the patterned substrate after the assembly of the first substrate and the patterned substrate, wherein in a cross section view, a width of the first substrate is greater than or equal to a width of the patterned substrate;

providing a second base with a material layer;

arranging the mask substrate and the second base correspondingly;

performing exposure and development processes on the material layer to form the target substrate; and

removing the mask substrate.