US 11,867,860 B2
Seismic data acquisition unit
Michael Morris, Sugar Land, TX (US); and Sam Hand, Houston, TX (US)
Assigned to Magseis FF LLC, Houston, TX (US)
Filed by Magseis FF LLC, Houston, TX (US)
Filed on Feb. 13, 2020, as Appl. No. 16/790,184.
Application 16/790,184 is a continuation of application No. 16/003,226, filed on Jun. 8, 2018, granted, now 10,571,588.
Claims priority of provisional application 62/517,778, filed on Jun. 9, 2017.
Prior Publication US 2020/0183037 A1, Jun. 11, 2020
Int. Cl. G01V 1/38 (2006.01); G01V 1/16 (2006.01)
CPC G01V 1/3808 (2013.01) [G01V 1/16 (2013.01); G01V 1/3843 (2013.01); G01V 2210/1423 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system to perform a seismic survey, comprising:
a seismic data acquisition unit comprising:
a first connector positioned at a first portion of the seismic data acquisition unit, the first connector comprising a first snap ring, a first pin interconnect separate from the first snap ring, and a first socket insert separate from the first snap ring and the first pin interconnect; and
a set of first cleats forms a first cleat ring and a set of second cleats forms a second cleat ring, the set of first cleats is positioned on a perimeter of the seismic data acquisition unit, and the set of second cleats is positioned in proximity to the set of first cleats, and the first cleats and the second cleats are offset from each other, wherein an overlapping portion of the first cleats and the second cleats is less than 60%,
the first snap ring to contact the first pin interconnect and lock the first pin interconnect in contact with the first socket insert, the first pin interconnect comprising one or more pins to contact an aqueous medium, a seal surface, and a rubber boot to prevent contact between the aqueous medium and the first socket insert; and
the first socket insert to contact electronic circuitry located within the seismic data acquisition unit.