US 11,867,852 B1
Photonic chip based atomic sensors
Matthew Todd Cashen, Pleasanton, CA (US); Martin Machai Boyd, Pleasanton, CA (US); and Christopher Scott Corder, Berkeley, CA (US)
Assigned to Vector Atomic, Inc., Pleasanton, CA (US)
Filed by Vector Atomic, Inc., Pleasanton, CA (US)
Filed on Jun. 23, 2023, as Appl. No. 18/340,396.
Int. Cl. G21K 1/02 (2006.01); G01T 3/00 (2006.01)
CPC G01T 3/00 (2013.01) 23 Claims
OG exemplary drawing
 
1. An atomic sensor, comprising:
a photonic die comprising a plurality of optical interfaces configured to emit a plurality of optical signals on a top surface;
an atomic source disposed on the top surface, the atomic source configured to emit atoms; and
a collimator disposed on the top surface, the collimator configured to receive the atoms from the atomic source and direct them onto an atomic path that intersects the plurality of optical signals emitted by the photonic die.