CPC G01R 31/303 (2013.01) [B06B 1/0622 (2013.01); G01N 29/00 (2013.01); G01N 29/22 (2013.01); G01N 29/225 (2013.01)] | 23 Claims |
1. A system, comprising:
an interposer layer;
a circuit layer positioned on the interposer layer and electrically coupled to the interposer layer, the circuit layer comprising a plurality of sonically-enabled pads; and
an interrogator layer positioned on the circuit layer and comprising a plurality of ultrasonic transducers configured to sonically interrogate the circuit layer;
wherein the sonically-enabled pads are configured to generate an electrical signal in response to sonic interrogation from the interrogator layer, if the sonically-enabled pad is functional.
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