US 11,867,754 B2
Sonic testing method, apparatus and applications
Amit Lal, Ithaca, NY (US); and Christopher Batten, Ithaca, NY (US)
Assigned to Cornell University, Ithaca, NY (US)
Appl. No. 16/631,590
Filed by CORNELL UNIVERSITY, Ithaca, NY (US)
PCT Filed Jul. 17, 2018, PCT No. PCT/US2018/042371
§ 371(c)(1), (2) Date Jan. 16, 2020,
PCT Pub. No. WO2019/018328, PCT Pub. Date Jan. 24, 2019.
Claims priority of provisional application 62/533,390, filed on Jul. 17, 2017.
Prior Publication US 2020/0182930 A1, Jun. 11, 2020
Int. Cl. G01R 31/303 (2006.01); B06B 1/06 (2006.01); G01N 29/22 (2006.01); G01N 29/00 (2006.01)
CPC G01R 31/303 (2013.01) [B06B 1/0622 (2013.01); G01N 29/00 (2013.01); G01N 29/22 (2013.01); G01N 29/225 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A system, comprising:
an interposer layer;
a circuit layer positioned on the interposer layer and electrically coupled to the interposer layer, the circuit layer comprising a plurality of sonically-enabled pads; and
an interrogator layer positioned on the circuit layer and comprising a plurality of ultrasonic transducers configured to sonically interrogate the circuit layer;
wherein the sonically-enabled pads are configured to generate an electrical signal in response to sonic interrogation from the interrogator layer, if the sonically-enabled pad is functional.