US 11,867,595 B2
X-ray reflectometry apparatus and method thereof for measuring three dimensional nanostructures on flat substrate
Chun-Ting Liu, Taichung (TW); Wen-Li Wu, Hsinchu (TW); Bo-Ching He, Hsinchu (TW); Guo-Dung Chen, New Taipei (TW); Sheng-Hsun Wu, Zhubei (TW); and Wei-En Fu, Taoyuan (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Nov. 22, 2021, as Appl. No. 17/532,767.
Application 17/532,767 is a continuation in part of application No. 17/037,115, filed on Sep. 29, 2020, granted, now 11,579,099.
Claims priority of provisional application 62/914,567, filed on Oct. 14, 2019.
Claims priority of application No. 109123688 (TW), filed on Jul. 14, 2020.
Prior Publication US 2022/0120561 A1, Apr. 21, 2022
Int. Cl. G01N 23/20 (2018.01); G01N 23/20008 (2018.01)
CPC G01N 23/20 (2013.01) [G01N 23/20008 (2013.01); G01N 2223/051 (2013.01); G01N 2223/052 (2013.01); G01N 2223/1003 (2013.01); G01N 2223/1016 (2013.01); G01N 2223/315 (2013.01); G01N 2223/611 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An X-ray reflectometry apparatus for measuring a three-dimensional nanostructure on a flat substrate, comprising:
an X-ray source for emitting an X-ray of one wavelength in a multi-wavelength range of 0.154 nm-20 nm;
an X-ray reflector comprising multiple mirrors or a X-ray monochromator;
a six-axis platform configured to control a focus distance of the X-ray reflector such that the focus distance is ≥150 mm, so that the X-ray is point focused on a sample surface from an incident angle ≥24° and a footprint of the focused X-ray is less than or equal to 10 μm×25 μm;
an incident slit disposed between the X-ray reflector and the sample surface, wherein the focused X-ray is controlled by the incident slit to change a divergence angle, and the incident slit is an aperture optical element or a slit element that is controlled in at least one direction;
an X-ray detector configured to collect reflecting and scattering signals from the sample surface, which includes a 2-dimensional X-ray sensor inside a vacuum chamber and an analyzer outside the vacuum chamber; and
a controller configured to control the 2-dimensional X-ray sensor to move along a z-axis with the incident angle of the focused X-ray for collecting the scattering and reflecting signals.