US 11,867,583 B2
Leadless pressure sensors
Manjesh Kumar B, Karnataka (IN); Alistair David Bradley, Hilliard, OH (US); Josh M. Fribley, Columbus, OH (US); Sudheer Beligere Sreeramu, Karnataka (IN); and Sathish Vadlamudi, Karnataka (IN)
Assigned to Honeywell International Inc., Charlotte, NC (US)
Filed by Honeywell International Inc., Morris Plains, NJ (US)
Filed on Nov. 3, 2022, as Appl. No. 17/980,506.
Application 17/980,506 is a continuation of application No. 16/728,490, filed on Dec. 27, 2019, granted, now 11,519,800.
Prior Publication US 2023/0086677 A1, Mar. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01L 9/00 (2006.01); B81B 7/00 (2006.01); H05K 1/14 (2006.01); H10N 30/30 (2023.01)
CPC G01L 9/0055 (2013.01) [B81B 7/0032 (2013.01); H05K 1/141 (2013.01); H10N 30/302 (2023.02); B81B 2201/0264 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a pressure sensor supported on the top surface of a substrate within a sensor housing, wherein the substrate defines an aperture;
a media retention collar disposed about an opening at a top end of the sensor housing; and
one or more metallic barriers disposed on a bottom surface of the substrate circumferentially about the first aperture, at least some of the one or more metallic barriers being at least partially coated with a solder mask,
wherein the one or more metallic barriers are configured to solder the substrate of the pressure sensor to a receiving circuit board.