CPC G01L 9/0055 (2013.01) [B81B 7/0032 (2013.01); H05K 1/141 (2013.01); H10N 30/302 (2023.02); B81B 2201/0264 (2013.01)] | 20 Claims |
1. An apparatus comprising:
a pressure sensor supported on the top surface of a substrate within a sensor housing, wherein the substrate defines an aperture;
a media retention collar disposed about an opening at a top end of the sensor housing; and
one or more metallic barriers disposed on a bottom surface of the substrate circumferentially about the first aperture, at least some of the one or more metallic barriers being at least partially coated with a solder mask,
wherein the one or more metallic barriers are configured to solder the substrate of the pressure sensor to a receiving circuit board.
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