US 11,867,575 B2
Miniature pressure/force sensor with integrated leads
Michael W. Davis, Rockford, MN (US); Peter F. Ladwig, Hutchinson, MN (US); Matthew S. Lang, Excelsior, MN (US); Dean E. Myers, Stewart, MN (US); Clark T. Olsen, Dassel, MN (US); and Douglas P. Riemer, Waconia, MN (US)
Assigned to Hutchinson Technology Incorporated, Hutchinson, MN (US)
Filed by Hutchinson Technology Incorporated, Hutchinson, MN (US)
Filed on Jan. 28, 2022, as Appl. No. 17/587,865.
Application 17/587,865 is a division of application No. 15/424,282, filed on Feb. 3, 2017, granted, now 11,243,127.
Claims priority of provisional application 62/403,765, filed on Oct. 4, 2016.
Claims priority of provisional application 62/290,789, filed on Feb. 3, 2016.
Prior Publication US 2022/0196494 A1, Jun. 23, 2022
Int. Cl. G01L 1/22 (2006.01); G01L 1/14 (2006.01)
CPC G01L 1/2268 (2013.01) [G01L 1/146 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A pressure/force sensor comprising:
a diaphragm structure including a sensing element;
a lead structure extending from the diaphragm structure, the lead structure including first and second traces electrically coupled to the sensing element, wherein the first trace is electrically connected to a first electrode, and wherein the second trace is electrically connected to a second electrode; and
wherein the diaphragm structure and the lead structure include a circuit assembly comprising:
a common insulating layer;
a via connecting the second electrode to the second trace through the common insulating layer; and
a common conductor layer on the insulating layer, including at least a portion of the sensing element and at least the first trace.