US 11,866,808 B2
Method for manufacturing thixomolding material
Yasutoshi Hideshima, Nagano (JP); Hidefumi Nakamura, Aomori (JP); and Makoto Kato, Nagano (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 22, 2021, as Appl. No. 17/207,829.
Claims priority of application No. 2020-050637 (JP), filed on Mar. 23, 2020; and application No. 2020-190119 (JP), filed on Nov. 16, 2020.
Prior Publication US 2021/0291265 A1, Sep. 23, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 1/107 (2022.01); B22F 1/102 (2022.01); B22F 1/142 (2022.01); B22F 1/16 (2022.01); B22F 1/105 (2022.01); C22C 23/02 (2006.01)
CPC C22C 23/02 (2013.01) [B22F 1/102 (2022.01); B22F 1/107 (2022.01); B22F 1/142 (2022.01); B22F 1/16 (2022.01); B22F 1/105 (2022.01); B22F 2301/058 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A method for manufacturing a thixomolding material comprising:
a drying step of heating a mixture containing a first powder that contains Mg as a main component, a second powder that contains C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture so that the second powder covers the first powder with the second powder being attached to a surface of the first powder;
a stirring step of stirring the mixture heated in the drying step; and
a debindering step of debindering at least a part of the binder contained in the mixture so that an attachment amount of the second powder attached to the first powder is 9.2% or greater and 27.9% or less after removal of the part of the binder, the attachment amount being a ratio of a mass of the second powder attached to the first powder with respect to a mass of the first powder.