CPC C08F 290/062 (2013.01) [B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 1/036 (2013.01); B32B 2250/05 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0355 (2013.01)] | 12 Claims |
1. A copper-clad laminate comprising:
an insulating layer containing a cured product of a resin composition; and
a surface treated copper foil in contact with one surface or both surfaces of the insulating layer,
wherein the resin composition contains a compound having at least one group represented by a following Formula (1) or (2) in a molecule and a crosslinking type curing agent:
(in Formula (1), s represents an integer 0 to 10, Z represents an arylene group, and R1 and R3 each independently represent a hydrogen atom or an alkyl group)
(in Formula (2), R4 represents a hydrogen atom or an alkyl group), and
the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil, wherein
the finely roughened particle treatment layer is formed of fine copper particles having a particle size of 40 to 200 nm,
a heat resistance treatment layer containing nickel is provided on the finely roughened particle treatment layer,
a rust prevention treatment layer containing at least chromium is provided on the heat resistance treatment layer,
a silane coupling agent treatment layer is provided on the rust prevention treatment layer, and
an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.
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