US 11,866,536 B2
Copper-clad laminate plate, resin-attached copper foil, and circuit board using same
Yuki Kitai, Osaka (JP); Masashi Koda, Fukushima (JP); Yasunori Hoshino, Osaka (JP); Atsushi Wada, Osaka (JP); and Mikio Sato, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Appl. No. 17/426,400
Filed by PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
PCT Filed Dec. 18, 2019, PCT No. PCT/JP2019/049693
§ 371(c)(1), (2) Date Jul. 28, 2021,
PCT Pub. No. WO2020/162056, PCT Pub. Date Aug. 13, 2020.
Claims priority of application No. 2019-018130 (JP), filed on Feb. 4, 2019.
Prior Publication US 2022/0106426 A1, Apr. 7, 2022
Int. Cl. C08F 290/06 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C25D 3/38 (2006.01); C25D 7/00 (2006.01); H05K 1/03 (2006.01)
CPC C08F 290/062 (2013.01) [B32B 5/02 (2013.01); B32B 5/26 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C25D 3/38 (2013.01); C25D 7/00 (2013.01); H05K 1/036 (2013.01); B32B 2250/05 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0355 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A copper-clad laminate comprising:
an insulating layer containing a cured product of a resin composition; and
a surface treated copper foil in contact with one surface or both surfaces of the insulating layer,
wherein the resin composition contains a compound having at least one group represented by a following Formula (1) or (2) in a molecule and a crosslinking type curing agent:

OG Complex Work Unit Chemistry
(in Formula (1), s represents an integer 0 to 10, Z represents an arylene group, and R1 and R3 each independently represent a hydrogen atom or an alkyl group)

OG Complex Work Unit Chemistry
(in Formula (2), R4 represents a hydrogen atom or an alkyl group), and
the surface treated copper foil is a surface treated copper foil including a finely roughened particle treatment layer of copper on at least one surface side of copper foil, wherein
the finely roughened particle treatment layer is formed of fine copper particles having a particle size of 40 to 200 nm,
a heat resistance treatment layer containing nickel is provided on the finely roughened particle treatment layer,
a rust prevention treatment layer containing at least chromium is provided on the heat resistance treatment layer,
a silane coupling agent treatment layer is provided on the rust prevention treatment layer, and
an amount of nickel attached in the heat resistance treatment layer is 30 to 60 mg/m2.