US 11,866,535 B2
Two-part epoxy based composition
AiFu Che, Shanghai (CN); Chunfu Chen, Kanagawa (JP); Bin Li, Shanghai (CN); and Chao Wang, Shanghai (CN)
Assigned to Henkel AG & Co. KGaA, Duesseldorf (DE)
Filed by Henkel AG & Co. KGaA, Düsseldorf (DE)
Filed on Jan. 20, 2021, as Appl. No. 17/153,027.
Application 17/153,027 is a continuation of application No. PCT/CN2018/097342, filed on Jul. 27, 2018.
Prior Publication US 2021/0171694 A1, Jun. 10, 2021
Int. Cl. C09J 163/00 (2006.01); C08G 59/44 (2006.01); C08G 59/46 (2006.01); C08F 283/10 (2006.01)
CPC C08F 283/10 (2013.01) 11 Claims
 
1. A two-part epoxy based composition comprising:
(a) a first part comprising at least one epoxy resin;
(b) a second part comprising:
(i) from 5 to 75% by weight of the second part of at least one epoxy resin curing agent; and
(ii) from 25 to 95% by weight of the second part of at least one acrylamide compound represented by the following general formula (1):

OG Complex Work Unit Chemistry
wherein R1, R2 and R3 are identical or different, and independently represent hydrogen atoms or optionally substituted univalent organic groups; and
wherein at least one of R2 and R3 is a hydrogen atom;
wherein a mixture of the first part and the second part can be cured at room temperature to produce a cured product of the two-part epoxy based composition.
 
11. An article bonded by the two-part epoxy based composition according to claim 1.