	US 11,866,534 B2
	Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition comprising same
Hyeonuk Kang, Daejeon (KR); Do Hyun Byun, Daejeon (KR); and Kyongjun Yoon, Daejeon (KR)
Assigned to HANWHA SOLUTIONS CORPORATION, Seoul (KR)
Appl. No. 17/299,797
Filed by HANWHA SOLUTIONS CORPORATION, Seoul (KR)
PCT Filed Oct. 31, 2019, PCT No. PCT/KR2019/014534 § 371(c)(1), (2) Date Jun. 4, 2021, PCT Pub. No. WO2020/116788, PCT Pub. Date Jun. 11, 2020.
Claims priority of application No. 10-2018-0154896 (KR), filed on Dec. 5, 2018.
Prior Publication US 2022/0025094 A1, Jan. 27, 2022
Int. Cl. C08F 232/08 (2006.01); C08F 226/02 (2006.01); C08L 91/00 (2006.01); C09J 11/08 (2006.01); C09J 145/00 (2006.01)

CPC C08F 232/08 (2013.01) [C08F 226/02 (2013.01); C08L 91/00 (2013.01); C09J 11/08 (2013.01); C09J 145/00 (2013.01); C09J 2301/312 (2020.08)]

6 Claims

1. An adhesive resin composition comprising a dicyclopentadiene-based hydrogenated resin and a thermoplastic resin,

wherein the dicyclopentadien-based hydrogenated resin is prepared by hydrogenating a dicyclopentadiene-based resin prepared by copolymerizing a monomer composition including a dicyclopentadiene-based monomer and a vinylamide-based monomer, and the adhesive resin composition has a mixed methylcyclohexane and aniline cloud point of 60° C. or lower, and a diacetone cloud point of 60° C. or lower,

and wherein the dicyclopentadiene-based resin has a number average molecular weight (Mn) of 200 to 1,200 g/mol, a weight average molecular weight (Mw) of 250 to 4,000 g/mol, and a Z average molecular weight (Mz) of 300 to 5,000 g/mol.