US 11,865,671 B2
Temperature-based in-situ edge assymetry correction during CMP
Haosheng Wu, San Jose, CA (US); Shou-Sung Chang, Mountain View, CA (US); Jianshe Tang, San Jose, CA (US); Chih Chung Chou, San Jose, CA (US); Hui Chen, San Jose, CA (US); Hari Soundararajan, Sunnyvale, CA (US); and Benjamin Cherian, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Apr. 15, 2020, as Appl. No. 16/849,884.
Claims priority of provisional application 62/836,007, filed on Apr. 18, 2019.
Prior Publication US 2020/0331114 A1, Oct. 22, 2020
Int. Cl. B24B 57/02 (2006.01); H01L 21/304 (2006.01); B24B 37/04 (2012.01); B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 37/22 (2012.01); B24B 37/34 (2012.01); B24B 55/02 (2006.01); B24B 53/017 (2012.01); B24B 49/14 (2006.01)
CPC B24B 57/02 (2013.01) [B24B 37/015 (2013.01); B24B 37/042 (2013.01); B24B 37/105 (2013.01); B24B 37/22 (2013.01); B24B 37/34 (2013.01); B24B 55/02 (2013.01); H01L 21/304 (2013.01); B24B 49/14 (2013.01); B24B 53/017 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing apparatus comprising:
a platen to hold a polishing pad;
a rotatable carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, the carrier head laterally movable by a first actuator across the polishing pad and rotatable by a second actuator;
a thermal control system including one or more independently controllable heaters and/or coolers to independently control temperatures of at least one zone of a plurality of zones on the polishing pad relative to another zone of the plurality of zones; and
a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature, the controller further configured to
control the first actuator and the second actuator to synchronize lateral oscillation of the carrier head with rotation of the carrier head such that over each of a plurality of successive oscillations of the carrier head, a first angular swath of an annular edge portion of the substrate contacts the first zone when the first angular swath is at an azimuthal angle about an axis of rotation of the carrier head, and when a second angular swath of the annular edge portion of the substrate is at the azimuthal angle the second angular swath contacts the second zone, the first angular swath and the second angular swath being different arc portions of the annular edge portion.