CPC B23K 26/206 (2013.01) [A61N 1/3754 (2013.01); A61N 1/3968 (2013.01); B23K 26/32 (2013.01)] | 20 Claims |
1. A hermetic assembly comprising:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate by a laser bond; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate.
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9. A hermetically-sealed package comprising a housing and a hermetic assembly that forms a part of the housing, wherein the hermetic assembly comprises:
a dielectric substrate comprising a first major surface and a second major surface;
a patterned layer connected to the first major surface of the dielectric substrate by a laser bond; and
a ferrule comprising a body and a flange extending from the body, wherein the flange is welded to a welding portion of the patterned layer that is disposed between the flange and the first major surface of the dielectric substrate such that the ferrule is hermetically sealed to the dielectric substrate;
wherein an edge of the body of the ferrule is connected to an edge of the housing.
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14. A method comprising:
laser bonding a patterned layer to a first major surface of a dielectric substrate; and
welding a flange of a ferrule to a welding portion of the patterned layer such that the welding portion is between the flange and the first major surface of the dielectric substrate and the ferrule is hermetically sealed to the dielectric substrate, wherein the flange extends from a body of the ferrule.
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