US 11,865,609 B2
Method for manufacturing powder-modified magnesium alloy chip
Koichi Ozaki, Okayama (JP); Tadao Fukuta, Kurashiki (JP); Yasutoshi Hideshima, Nagano (JP); and Makoto Kato, Nagano (JP)
Assigned to Seiko Epson Corporation, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 22, 2021, as Appl. No. 17/207,814.
Claims priority of application No. 2020-050633 (JP), filed on Mar. 23, 2020; and application No. 2020-190118 (JP), filed on Nov. 16, 2020.
Prior Publication US 2021/0291266 A1, Sep. 23, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 1/148 (2022.01); B22F 1/068 (2022.01); B22D 17/00 (2006.01)
CPC B22D 17/007 (2013.01) [B22F 1/068 (2022.01); B22F 1/148 (2022.01); B22F 2301/058 (2013.01); B22F 2302/40 (2013.01); B22F 2303/01 (2013.01); B22F 2303/20 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method for manufacturing a powder-modified magnesium alloy chip for thixomolding, the method comprising:
a drying step of heating a mixture containing an Mg chip containing Mg as a main component, a C powder containing C as a main component, a binder, and an organic solvent to dry the organic solvent contained in the mixture;
a stirring step of stirring the mixture heated in the drying step; and
a degreasing step of heating the mixture to remove at least a part of the binder contained in the mixture after the stirring step and the drying step are completed so that an attachment amount of the C powder attached to the Mg chip is 8.8% or greater and 28.0% or less after removal of the part of the binder, the attachment amount being a ratio of a weight of the C powder attached to the Mg chip with respect to a weight of the Mg chip, wherein
the drying step and the stirring step are alternately performed for a plurality of times.