US 11,865,588 B2
Probe pin cleaning pad and cleaning method for probe pin
Chun-Fa Chen, Hsinchu County (TW); Chi-Hua Huang, Hsinchu County (TW); Yu-Hsuen Lee, Hsinchu County (TW); Ching-Wen Hsu, Hsinchu County (TW); Chao-Hsuan Yang, Hsinchu County (TW); Ting-Wei Lin, Hsinchu County (TW); Chin-Kai Lin, Hsinchu County (TW); and Chen-Ju Lee, Hsinchu County (TW)
Assigned to Alliance Material Co., Ltd., Hsinchu County (TW)
Filed by Alliance Material Co., Ltd., Hsinchu County (TW)
Filed on Mar. 10, 2022, as Appl. No. 17/691,129.
Application 17/691,129 is a continuation in part of application No. 17/095,747, filed on Nov. 12, 2020, abandoned.
Claims priority of provisional application 62/933,990, filed on Nov. 12, 2019.
Claims priority of application No. 109106766 (TW), filed on Mar. 2, 2020; and application No. 109136656 (TW), filed on Oct. 22, 2020.
Prior Publication US 2022/0193733 A1, Jun. 23, 2022
Int. Cl. B08B 1/00 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); B32B 27/20 (2006.01); B32B 27/08 (2006.01); B24B 19/16 (2006.01); B24D 11/00 (2006.01); G01R 1/067 (2006.01)
CPC B08B 1/001 (2013.01) [B24B 19/16 (2013.01); B24D 11/00 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 2250/05 (2013.01); B32B 2264/0214 (2013.01); B32B 2264/10 (2013.01); B32B 2307/536 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2432/00 (2013.01); G01R 1/067 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A probe pin cleaning pad, comprising:
a release layer or composite material;
an adhesive layer, disposed on the release layer or composite material;
a substrate layer, disposed on the adhesive layer;
a cleaning layer, disposed on the substrate layer, wherein a material of the cleaning layer comprises:
silicone resin having a cross-linked network structure; and
organic particles, wherein the organic particles have a Mohs hardness of less than 7; and
a polishing layer, disposed on the cleaning layer, wherein a material of the polishing layer comprises:
resin; and
inorganic particles, wherein the inorganic particles have a Mohs hardness of large than or equal to 7,
wherein a Young's modulus of the polishing layer is larger than a Young's modulus of the cleaning layer,
wherein the probe pin cleaning pad is adapted for a probe pin with a plurality of substance attached thereto to penetrate through the polishing layer and to further penetrate into the cleaning layer for cleaning, and during the probe pin separating being sequentially extracted from the cleaning layer and the polishing layer, the plurality of substance are removed from the probe pin and are captured and/or trapped in the cross-linked network structure of the silicon resin of the cleaning layer.