CPC B08B 1/001 (2013.01) [B24B 19/16 (2013.01); B24D 11/00 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/283 (2013.01); B32B 2250/05 (2013.01); B32B 2264/0214 (2013.01); B32B 2264/10 (2013.01); B32B 2307/536 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2432/00 (2013.01); G01R 1/067 (2013.01)] | 7 Claims |
1. A probe pin cleaning pad, comprising:
a release layer or composite material;
an adhesive layer, disposed on the release layer or composite material;
a substrate layer, disposed on the adhesive layer;
a cleaning layer, disposed on the substrate layer, wherein a material of the cleaning layer comprises:
silicone resin having a cross-linked network structure; and
organic particles, wherein the organic particles have a Mohs hardness of less than 7; and
a polishing layer, disposed on the cleaning layer, wherein a material of the polishing layer comprises:
resin; and
inorganic particles, wherein the inorganic particles have a Mohs hardness of large than or equal to 7,
wherein a Young's modulus of the polishing layer is larger than a Young's modulus of the cleaning layer,
wherein the probe pin cleaning pad is adapted for a probe pin with a plurality of substance attached thereto to penetrate through the polishing layer and to further penetrate into the cleaning layer for cleaning, and during the probe pin separating being sequentially extracted from the cleaning layer and the polishing layer, the plurality of substance are removed from the probe pin and are captured and/or trapped in the cross-linked network structure of the silicon resin of the cleaning layer.
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