US 11,865,529 B2
Honeycomb structure and electrically heating support
Takayuki Inoue, Nagoya (JP); Makoto Hamazaki, Nagoya (JP); and Kohei Yamada, Nagoya (JP)
Assigned to NGK INSULATORS, LTD., Nagoya (JP)
Filed by NGK INSULATORS, LTD., Nagoya (JP)
Filed on Jan. 14, 2022, as Appl. No. 17/575,812.
Claims priority of application No. 2021-042752 (JP), filed on Mar. 16, 2021.
Prior Publication US 2022/0297103 A1, Sep. 22, 2022
Int. Cl. B01J 21/06 (2006.01); B01J 21/08 (2006.01); B01J 21/18 (2006.01); B01J 35/04 (2006.01); H05B 3/00 (2006.01); H05B 3/14 (2006.01)
CPC B01J 35/04 (2013.01) [B01J 21/18 (2013.01); H05B 3/0004 (2013.01); H05B 3/141 (2013.01); H05B 2203/016 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A ceramic honeycomb structure, comprising: an outer peripheral wall; and a partition wall disposed on an inner side of the outer peripheral wall, the partition wall defining a plurality of cells, each of the plurality of cells to form a fluid flow path extending from one end face to other end face,
wherein the honeycomb structure contains:
1) Particles comprising one or more selected from silicon carbide, silicon nitride and aluminum nitride; and
2) Silicon doped with a dopant,
wherein the dopant is a Group 13 element or a Group 15 element, and
wherein the honeycomb structure has a silicon content of from 20 to 80% by mass, and the honeycomb structure has a porosity of 30% or less.