CPC B01J 23/26 (2013.01) [B01J 21/063 (2013.01); B01J 21/08 (2013.01); B01J 35/023 (2013.01); B01J 35/1019 (2013.01); B01J 35/1023 (2013.01); B01J 35/1042 (2013.01); B01J 35/1047 (2013.01); B01J 37/0203 (2013.01); B01J 37/0207 (2013.01); B01J 37/0209 (2013.01); B01J 37/035 (2013.01); B01J 37/04 (2013.01); C08F 4/18 (2013.01); C08F 4/24 (2013.01); C08F 10/00 (2013.01); C08F 10/02 (2013.01); B01J 31/0212 (2013.01); B01J 31/0274 (2013.01); B01J 31/0275 (2013.01); B01J 31/34 (2013.01); B01J 31/38 (2013.01); B01J 2231/12 (2013.01)] | 21 Claims |
1. A process for preparing a titanium-silicon complex, the process comprising:
(1) contacting a silicon compound with water and an acid or a base in a solvent to form a first solution containing a partially-hydrolyzed silicon material, wherein a molar ratio of water to silicon is in a range from about 0.2:1 to about 0.8:1, a weight ratio of the acid or the base to the solvent is from about 1:2000 to about 1:20, and the silicon compound comprises a silicon alkoxide; and
(2) contacting a titanium compound with the first solution containing the partially-hydrolyzed silicon material at a molar ratio of titanium to silicon from about 0.3:1 to about 0.9:1 to form a second solution containing the titanium-silicon complex.
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