US 11,864,916 B2
Three-dimensional adhesive device having a microelectronic system embedded therein
Susanne Holm Faarbaek, Vaerloese (DK); Karsten Hoppe, Copenhagen (DK); Peter Boman Samuelsen, Rungsted Kyst (DK); and Jens Branebjerg, Hoersholm (DK)
Assigned to Braemar Manufacturing LLC, Eagan, MN (US)
Filed by Braemar Manufacturing, LLC, Eagan, MN (US)
Filed on Aug. 13, 2020, as Appl. No. 16/992,185.
Application 16/992,185 is a continuation of application No. 16/291,339, filed on Mar. 4, 2019.
Application 16/291,339 is a continuation of application No. 11/886,032, abandoned, previously published as PCT/DK2006/050006, filed on Mar. 9, 2006.
Claims priority of application No. PA 2005 00354 (DK), filed on Mar. 9, 2005; and application No. PA 2005 01748 (DK), filed on Dec. 9, 2005.
Prior Publication US 2021/0022683 A1, Jan. 28, 2021
Int. Cl. A61B 5/00 (2006.01); A61B 5/145 (2006.01); A61B 5/02 (2006.01); A61B 5/024 (2006.01); A61B 5/296 (2021.01)
CPC A61B 5/68335 (2017.08) [A61B 5/0002 (2013.01); A61B 5/411 (2013.01); A61B 5/6833 (2013.01); A61B 5/02 (2013.01); A61B 5/024 (2013.01); A61B 5/14532 (2013.01); A61B 5/14539 (2013.01); A61B 5/14542 (2013.01); A61B 5/14546 (2013.01); A61B 5/296 (2021.01); A61B 2560/0412 (2013.01); A61B 2562/08 (2013.01); Y10T 29/49002 (2015.01); Y10T 428/14 (2015.01)] 19 Claims
OG exemplary drawing
 
1. An adhesive device to be attached to a body surface of a mammal, comprising:
(a) dielectric adhesive envelope with periphery thickness less than 25% of its maximum thickness, the adhesive envelope having a sloping upper surface distal from the body surface of the mammal, wherein the sloping upper surface slopes downward in all directions from a maximum thickness in a center of the dielectric adhesive envelope toward the periphery thickness at a periphery of the dielectric adhesive envelope, and wherein the dielectric adhesive envelope comprises an essentially planar bottom surface proximal to the body surface of the mammal;
(b) a microelectronic system embedded in the adhesive envelope, the microelectronic system including:
a central processing unit (CPU), the CPU performing at least one of executing software, analyzing data, data decisions making, signal processing, routing, timing, power management, and controlling and communicating with at least one component of the microelectronic system;
a storage component performing at least one of storing the software executed by the CPU, storing acquired data, and storing data processed by the CPU;
a communication component having hardware and software to control communication to and from the microelectronic system, wherein the communication to and from the microelectronic system includes at least one of wireless communication, audible communication, and optical communication;
a power source for powering at least a part of the microelectronic circuit, the power source comprising at least one of power regulating electronics, recharge electronics, and an energy source; and
a transducer component capable of at least one of detecting a physiological condition, influencing a physiological condition, detecting a neurological condition, and influencing a neurological condition;
(c) a capsule enclosing at least a portion of the microelectronic system to protect the at least a portion of the microelectronic system from exterior influence;
(d) a mechanical coupling disposed on at least a portion of the capsule and configured to allow the capsule and the at least a portion of the microelectronic system to detach from the adhesive envelope; and
(e) a cover layer made of substantially elastic material attached to the upper surface of the adhesive envelope, wherein the cover layer is designed to protect the adhesive envelope and at least a portion of the microelectronic system from adhering to an unwanted surface or other unwanted influence from the environment;
wherein the adhesive making up the adhesive envelope is a mouldable thermoplastic pressure sensitive adhesive having a flexibility enabling the adhesive device to conform to a curvature of envelope parts while retaining its adhesive properties even under movements; and
wherein one or more components of the microelectronic system is integrated into the adhesive envelope and is covered by the adhesive envelope on all sides and other remaining components of the microelectronic system are located elsewhere in the adhesive envelope, the components of the microelectronic system having the necessary mechanical and electrical connection to each other.