US 11,864,357 B2
Double-sided cooling cold plates with overhanging heat sinks and through body busbar for high-power density power electronics
Feng Zhou, Ann Arbor, MI (US); Yuqing Zhou, Ann Arbor, MI (US); Ercan Mehmet Dede, Ann Arbor, MI (US); Robert Erickson, Boulder, CO (US); Dragan Maksimovic, Boulder, CO (US); Vivek Sankaranarayanan, Boulder, CO (US); and Yucheng Gao, Boulder, CO (US)
Assigned to Toyota Motor Engineering and Manufacturing North America, Inc., Plano, TX (US); and University of Colorado Boulder, Boulder, CO (US)
Filed by TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., Plano, TX (US); and University of Colorado Boulder, Boulder, CO (US)
Filed on May 25, 2021, as Appl. No. 17/329,727.
Prior Publication US 2022/0386509 A1, Dec. 1, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20509 (2013.01) [H05K 7/209 (2013.01); H05K 7/20254 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A double-sided cold plate, comprising:
a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold;
a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface; and
a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.