US 11,864,355 B2
Thermal conductor and method for manufacturing thermal conductor
Katsuhiko Kagawa, Higashi-Osaka (JP); and Takayuki Yamaguchi, Higashi-Osaka (JP)
Assigned to SHOWA MARUTSUTSU COMPANY, LTD., Osaka (JP)
Appl. No. 17/923,149
Filed by SHOWA MARUTSUTSU COMPANY, LTD., Osaka (JP)
PCT Filed May 28, 2021, PCT No. PCT/JP2021/020410
§ 371(c)(1), (2) Date Nov. 3, 2022,
PCT Pub. No. WO2021/256220, PCT Pub. Date Dec. 23, 2021.
Claims priority of application No. 2020-106514 (JP), filed on Jun. 19, 2020.
Prior Publication US 2023/0328929 A1, Oct. 12, 2023
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/2039 (2013.01) [F28F 2255/02 (2013.01); F28F 2275/025 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A thermal conductor comprising a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other,
the thermal conductor having voids where neither the thermal conducting portion nor the joint portion is present, and
the thermal conductor satisfying a condition of 0.5≤[(S1−S0)/S0]×100≤20 when an area of the thermal conductor in a planar view in a first direction is expressed by S0 [cm2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm2].