CPC H05K 7/2039 (2013.01) [H05K 7/1427 (2013.01); H04B 10/40 (2013.01)] | 7 Claims |
1. An optical communication module comprising:
a circuit board;
optical communication devices that are provided on an upper surface side of the circuit board;
a case that accommodates the circuit board and the optical communication devices; and
a heatsink that is attached to the case,
wherein
the optical communication devices include a first device and a second device,
the first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is,
a height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device,
the heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided, and
the cooling air is provided through the inlet opening and flows in a direction from the first region where the first device is implemented to the second region where the second device is implemented in the case.
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