US 11,864,354 B2
Optical communication module equipped with heatsink
Kazuya Sasaki, Yokohama (JP); Takatoshi Yagisawa, Kawasaki (JP); Tsutomu Ohtsu, Hino (JP); and Masami Kamioka, Tochigi (JP)
Assigned to FUJITSU OPTICAL COMPONENTS LIMITED, Kawasaki (JP)
Filed by FUJITSU OPTICAL COMPONENTS LIMITED, Kawasaki (JP)
Filed on Sep. 22, 2021, as Appl. No. 17/481,492.
Claims priority of application No. 2020-160480 (JP), filed on Sep. 25, 2020.
Prior Publication US 2022/0104388 A1, Mar. 31, 2022
Int. Cl. H05K 7/14 (2006.01); H05K 7/20 (2006.01); H04B 10/40 (2013.01)
CPC H05K 7/2039 (2013.01) [H05K 7/1427 (2013.01); H04B 10/40 (2013.01)] 7 Claims
OG exemplary drawing
 
1. An optical communication module comprising:
a circuit board;
optical communication devices that are provided on an upper surface side of the circuit board;
a case that accommodates the circuit board and the optical communication devices; and
a heatsink that is attached to the case,
wherein
the optical communication devices include a first device and a second device,
the first device is located closer to an inlet opening for cooling air for cooling the heatsink than the second device is,
a height from the circuit board to a top of the first device is greater than a height from the circuit board to a top of the second device,
the heatsink is not equipped with a cooling fin in a first region where the first device is provided, and the heatsink is equipped with a cooling fin in a second region where the second device is provided, and
the cooling air is provided through the inlet opening and flows in a direction from the first region where the first device is implemented to the second region where the second device is implemented in the case.