US 11,864,350 B2
Heat conduction apparatus and terminal device
Yongfu Sun, Dongguan (CN); Jian Shi, Shanghai (CN); Jie Yang, Dongguan (CN); Linfang Jin, Dongguan (CN); and Zhen Sun, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Appl. No. 17/631,256
Filed by Huawei Technologies Co., Ltd., Shenzhen (CN)
PCT Filed Jul. 23, 2020, PCT No. PCT/CN2020/103875
§ 371(c)(1), (2) Date Jan. 28, 2022,
PCT Pub. No. WO2021/018004, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 201910703924.0 (CN), filed on Jul. 31, 2019.
Prior Publication US 2022/0279683 A1, Sep. 1, 2022
Int. Cl. H05K 7/20 (2006.01); H05K 5/00 (2006.01)
CPC H05K 7/20336 (2013.01) [H05K 5/0017 (2013.01); H05K 7/2099 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a printed circuit board;
a first cover plate; and
a second cover plate, wherein the first cover plate is hermetically connected to the second cover plate, wherein:
the first cover plate defines a first plurality of grooves, and a supporting portion is disposed between two adjacent grooves of the first plurality of grooves,
each groove of the first plurality of grooves includes a liquid circulation channel and a vapor circulation channel, each liquid circulation channel is filled with a liquid working medium, and each liquid circulation channel is in communication with the corresponding vapor circulation channel in a manner that when the liquid working medium vaporizes into vapor, the vapor enters the corresponding vapor circulation channel and condenses into liquid, and the liquid enters the corresponding liquid circulation channel, and
a heat emitting element is disposed on the printed circuit board, a shielding can covers the heat emitting element, a via extends in the shielding can, a thermal interface material passes through the via and is in contact with the heat emitting element, and a middle frame is in contact with the thermal interface material.