US 11,864,319 B2
Z-axis interconnection with protruding component
Mario Schober, Trofaiach (AT); and Markus Leitgeb, Trofaiach (AT)
Assigned to AT&SAustria Technologie &Systemtechnik AG, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengeschaft, Leoben (AT)
Filed on Oct. 17, 2019, as Appl. No. 16/656,392.
Claims priority of application No. 18202076 (EP), filed on Oct. 23, 2018.
Prior Publication US 2020/0128669 A1, Apr. 23, 2020
Int. Cl. H05K 1/14 (2006.01); H01L 25/18 (2023.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/144 (2013.01) [H01L 25/18 (2013.01); H05K 1/023 (2013.01); H05K 1/0274 (2013.01); H05K 1/183 (2013.01); H05K 2201/10378 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a laminated stack comprising at least one electrically insulating layer structure and at least two electrically conductive layer structures and having a through hole extending from a first main surface of the stack to a second main surface of the stack;
an interposer in the through hole and having a higher density of connection elements than the stack;
a first active component mounted on a first main surface of the interposer; and
a second component mounted on a second main surface of the interposer and being connected to the first active component via the interposer;
wherein at least one of the first active component and the second component directly oppose the interposer,
wherein the second component is directly connected with the interposer and the stack;
wherein the second component forms a top chip, extends over edges of the interposer, and extends over a section of the second main surface of the stack surrounding the interposer;
wherein the electrically insulating layer structure comprises an organic material,
wherein said electrically insulating layer structure is cured against and between the two adjacent electrically conductive layer structures.