US 11,864,306 B2
Component carrier with an embedded thermally conductive block and manufacturing method
Erich Schlaffer, St. Lorenzen (AT); and Sebastian Sattler, Graz (AT)
Assigned to AT&SAustria Technologie & Systemtechnik AG, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Apr. 22, 2021, as Appl. No. 17/302,061.
Claims priority of application No. 20171558 (EP), filed on Apr. 27, 2020.
Prior Publication US 2021/0337653 A1, Oct. 28, 2021
Int. Cl. H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0204 (2013.01) [H05K 1/185 (2013.01); H05K 3/4611 (2013.01); H05K 2201/10416 (2013.01); H05K 2203/061 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a first layer stack comprising a plurality of first electrically conductive layer structures and a plurality of first electrically insulating layer structures wherein the first layer stack is a first pre-manufactured stack;
a component embedded in the first layer stack;
a second layer stack comprising a plurality of second electrically conductive layer structure and a plurality of second electrically insulating layer structures, wherein the second layer stack is a second pre-manufactured stack; and
a thermally conductive block embedded in the second layer stack;
wherein the first layer stack and the second layer stack are connected with each other so that a thermal path from the embedded component via the thermally conductive block up to an exterior surface of the component carrier has a minimum thermal conductivity of at least 7 W/mK;
wherein the first layer stack and the second layer stack are laminated together;
wherein the first layer stack and the second layer stack are connected by an electrically insulating layer;
wherein the electrically insulating layer comprises an opening at an interface between the component and the thermally conductive block;
wherein at least a part of a thermally conductive coupling medium is arranged within the opening to thermally connect the component and the thermally conductive block;
wherein the electrically insulating layer is arranged between one of the first electrically conductive layer structures of the first layer stack and one of the second electrically conductive layer structures of the second layer stack,
wherein the electrically insulating layer comprises a plurality of openings between the first electrically conductive layer structures and the second electrically conductive layer structures, and
wherein in at least a part of the openings thermally conductive material is arranged in order to thermally connect the first electrically conductive layer structure and the second electrically conductive layer structure.