CPC H04N 23/54 (2023.01) [A61B 1/00124 (2013.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); H04N 23/50 (2023.01); H04N 23/555 (2023.01)] | 6 Claims |
1. An imaging unit comprising:
a semiconductor package including an imaging device and having a back surface on which a sensor electrode is formed;
a circuit substrate including a connection electrode that is connected to the sensor electrode via a bump;
a surrounding part configured to cover the semiconductor package and the circuit substrate;
a filler with which a space that is enclosed by the surrounding part is filled to seal a circumference of the semiconductor package and the circuit substrate; and
a first cover configured to prevent the filler from infiltrating a joint between the semiconductor package and the circuit substrate.
|