US 11,863,851 B2
Imaging unit and endoscope
Toshiyuki Shimizu, Tokyo (JP)
Assigned to OLYMPUS CORPORATION, Tokyo (JP)
Filed by OLYMPUS CORPORATION, Tokyo (JP)
Filed on Aug. 14, 2020, as Appl. No. 16/993,354.
Application 16/993,354 is a continuation of application No. PCT/JP2018/034159, filed on Sep. 14, 2018.
Claims priority of application No. 2018-027984 (JP), filed on Feb. 20, 2018.
Prior Publication US 2020/0367734 A1, Nov. 26, 2020
Int. Cl. H04N 23/54 (2023.01); A61B 1/00 (2006.01); A61B 1/05 (2006.01); A61B 1/04 (2006.01); H04N 23/50 (2023.01)
CPC H04N 23/54 (2023.01) [A61B 1/00124 (2013.01); A61B 1/04 (2013.01); A61B 1/051 (2013.01); H04N 23/50 (2023.01); H04N 23/555 (2023.01)] 6 Claims
OG exemplary drawing
 
1. An imaging unit comprising:
a semiconductor package including an imaging device and having a back surface on which a sensor electrode is formed;
a circuit substrate including a connection electrode that is connected to the sensor electrode via a bump;
a surrounding part configured to cover the semiconductor package and the circuit substrate;
a filler with which a space that is enclosed by the surrounding part is filled to seal a circumference of the semiconductor package and the circuit substrate; and
a first cover configured to prevent the filler from infiltrating a joint between the semiconductor package and the circuit substrate.