US 11,862,929 B2
Laser diode packaging module, distance detection device, and electronic device
Xiang Liu, Shenzhen (CN); Guoguang Zheng, Shenzhen (CN); Xiaoping Hong, Shenzhen (CN); Mingyu Wang, Shenzhen (CN); and Shuai Dong, Shenzhen (CN)
Assigned to SZ DJI TECHNOLOGY CO., LTD., Shenzhen (CN)
Filed by SZ DJI TECHNOLOGY CO., LTD., Shenzhen (CN)
Filed on Feb. 2, 2021, as Appl. No. 17/165,744.
Application 17/165,744 is a continuation of application No. PCT/CN2018/098418, filed on Aug. 3, 2018.
Prior Publication US 2021/0159664 A1, May 27, 2021
Int. Cl. H01S 5/02255 (2021.01); H01S 5/02253 (2021.01)
CPC H01S 5/02255 (2021.01) [H01S 5/02253 (2021.01)] 21 Claims
OG exemplary drawing
 
1. A laser diode package module, comprising:
a substrate including a first surface;
a semiconductor mounted on the first surface;
a cover disposed on the first surface of the substrate;
an accommodation space formed between the substrate and the cover;
a laser diode die disposed in the accommodation space; and
a reflective surface disposed in the accommodation space for outputting light of the laser diode die reflected by the reflective surface and transmitted through a light-transmitting area, wherein;
the light-transmitting area is at least partially disposed on a surface of the cover opposite the substrate; and
notches or shallow grooves are disposed at sharp corners of a bottom surface of the semiconductor.