US 11,862,876 B2
Antenna and electronic device including the same
Dongyeon Kim, Suwon-si (KR); Hosaeng Kim, Suwon-si (KR); Seongjin Park, Suwon-si (KR); Sumin Yun, Suwon-si (KR); Myunghun Jeong, Suwon-si (KR); Jehun Jong, Suwon-si (KR); and Jaehoon Jo, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 8, 2020, as Appl. No. 17/014,471.
Claims priority of application No. 10-2019-0110473 (KR), filed on Sep. 6, 2019.
Prior Publication US 2021/0075115 A1, Mar. 11, 2021
Int. Cl. H01Q 9/04 (2006.01); H01Q 3/22 (2006.01); H01Q 1/24 (2006.01)
CPC H01Q 9/0485 (2013.01) [H01Q 1/243 (2013.01); H01Q 3/22 (2013.01); H01Q 9/0407 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing comprising a first cover facing a first direction, a second cover facing a second direction opposite to the first cover and lateral member surrounding an inner space between the first cover and the second cover, and the first cover having a first dielectric constant; and
an antenna structure disposed in the inner space of the housing and comprising:
a printed circuit board (PCB);
at least one antenna element disposed in the PCB to form a beam pattern in a third direction facing the lateral member and being perpendicular to the first direction;
a first dielectric structure disposed on a radiation path of the beam pattern, formed integrally with or combined with the PCB, and having a second dielectric constant, the first dielectric structure being spaced apart from the lateral member;
a second dielectric structure disposed on the radiation path between the first dielectric structure and the first cover, and having a third dielectric constant higher than the first dielectric constant and the second dielectric constant; and
a wireless communication circuit configured to at least one of transmit or receive a radio signal through the at least one antenna element,
wherein at least a part of the second dielectric structure is disposed between the PCB and the lateral member.