US 11,862,736 B2
Multi-dimensional photonic integrated circuits and memory structure having optical components mounted on multiple planes of a multi-dimensional package
Danny Rittman, Oceanside, CA (US); and Aliza Schnapp, Beverly Hills, CA (US)
Assigned to GBT Tokenize Corp., Santa Monica, CA (US)
Filed by GBT Technologies Inc., Santa Monica, CA (US)
Filed on Feb. 14, 2023, as Appl. No. 18/109,291.
Application 18/109,291 is a continuation in part of application No. 17/876,981, filed on Jul. 29, 2022.
Application 17/876,981 is a continuation of application No. 17/102,928, filed on Nov. 24, 2020, granted, now 11,411,127, issued on Aug. 9, 2022.
Application 17/102,928 is a continuation of application No. 16/292,388, filed on Mar. 5, 2019, granted, now 10,854,763, issued on Dec. 1, 2020.
Claims priority of provisional application 62/732,023, filed on Sep. 17, 2018.
Claims priority of provisional application 62/732,026, filed on Sep. 17, 2018.
Prior Publication US 2023/0207711 A1, Jun. 29, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 31/02 (2006.01); H01L 21/48 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/522 (2006.01); H01L 23/538 (2006.01); H01L 31/0475 (2014.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 31/02021 (2013.01) [H01L 21/486 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 25/0657 (2013.01); H01L 31/0475 (2014.12); H01L 24/97 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A multi-dimensional photonic integrated circuit comprising:
a substrate having a first side and a second side;
a multi-dimensional package having multi-dimensional planes, the multi-dimensional planes including one or more horizontal sides and one or more vertical sides; and
one or more optical components connected to the first side and the second side of the substrate and on the multi-dimensional planes of the multi-dimensional package;
wherein one or more of the optical components are mounted on at least one of the horizontal sides of the multi-dimensional package and one or more of the optical components are mounted on at least one of the vertical sides of the multi-dimensional package.