CPC H01L 31/02021 (2013.01) [H01L 21/486 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 25/0657 (2013.01); H01L 31/0475 (2014.12); H01L 24/97 (2013.01)] | 21 Claims |
1. A multi-dimensional photonic integrated circuit comprising:
a substrate having a first side and a second side;
a multi-dimensional package having multi-dimensional planes, the multi-dimensional planes including one or more horizontal sides and one or more vertical sides; and
one or more optical components connected to the first side and the second side of the substrate and on the multi-dimensional planes of the multi-dimensional package;
wherein one or more of the optical components are mounted on at least one of the horizontal sides of the multi-dimensional package and one or more of the optical components are mounted on at least one of the vertical sides of the multi-dimensional package.
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