US 11,862,656 B2
Semiconductor device and manufacturing method, and electronic appliance
Jun Ogi, Kanagawa (JP); Junichiro Fujimagari, Kanagawa (JP); Susumu Inoue, Kanagawa (JP); and Atsushi Fujiwara, Kumamoto (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Filed by SONY GROUP CORPORATION, Tokyo (JP)
Filed on Apr. 5, 2022, as Appl. No. 17/713,794.
Application 17/713,794 is a continuation of application No. 16/891,995, filed on Jun. 3, 2020, granted, now 11,322,539.
Application 16/891,995 is a continuation of application No. 16/242,764, filed on Jan. 8, 2019, granted, now 10,707,259, issued on Jul. 7, 2020.
Application 16/242,764 is a continuation of application No. 15/546,138, granted, now 10,199,419, issued on Feb. 5, 2019, previously published as PCT/JP2016/000932, filed on Feb. 22, 2016.
Claims priority of application No. 2015-043553 (JP), filed on Mar. 5, 2015.
Prior Publication US 2022/0231070 A1, Jul. 21, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01); H01L 23/00 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 27/1469 (2013.01); H01L 27/14627 (2013.01); H01L 27/14632 (2013.01); H01L 27/14634 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14687 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/48463 (2013.01); H01L 2924/146 (2013.01); H01L 2924/18161 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a first semiconductor chip, wherein the first semiconductor chip includes a first semiconductor substrate and a plurality of arrays of pixels, and wherein the first semiconductor chip has a rectangular shape;
a second semiconductor chip, wherein the second semiconductor chip includes a second semiconductor substrate, wherein the second semiconductor substrate has a rectangular shape, wherein an area of the second semiconductor substrate is less than an area of the first semiconductor substrate, and wherein the second semiconductor substrate is disposed on a light receiving surface side of the first semiconductor substrate; and
a third semiconductor chip, wherein the third semiconductor chip includes a third semiconductor substrate, wherein the third semiconductor substrate has a rectangular shape, wherein an area of the third semiconductor substrate is less than the area of the first semiconductor substrate, and wherein the third semiconductor substrate is disposed on the light receiving surface side of the first semiconductor substrate,
wherein a first array of pixels included in the plurality of arrays of pixels is adjacent to at least a portion of the second semiconductor substrate, and
wherein a second array of pixels included in the plurality of arrays of pixels is adjacent to at least a portion of the third semiconductor substrate.