US 11,862,652 B2
Image pickup element, method of manufacturing image pickup element, and electronic apparatus
Shuji Manda, Kumamoto (JP); Susumu Hiyama, Kumamoto (JP); and Yasuyuki Shiga, Kumamoto (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Filed by Sony Group Corporation, Tokyo (JP)
Filed on Nov. 21, 2022, as Appl. No. 17/991,184.
Application 17/991,184 is a continuation of application No. 17/145,488, filed on Jan. 11, 2021, granted, now 11,557,623.
Application 17/145,488 is a continuation of application No. 16/567,620, filed on Sep. 11, 2019, granted, now 10,950,644, issued on Mar. 16, 2021.
Application 16/567,620 is a continuation of application No. 15/865,057, filed on Jan. 8, 2018, granted, now 10,461,110, issued on Oct. 29, 2019.
Application 15/865,057 is a continuation of application No. 15/299,220, filed on Oct. 20, 2016, granted, now 9,893,105, issued on Feb. 13, 2018.
Application 15/299,220 is a continuation of application No. 15/079,834, filed on Mar. 24, 2016, granted, now 9,502,454, issued on Nov. 22, 2016.
Application 15/079,834 is a continuation of application No. 14/491,375, filed on Sep. 19, 2014, granted, now 9,337,226, issued on May 10, 2016.
Claims priority of application No. 2013-202123 (JP), filed on Sep. 27, 2013.
Prior Publication US 2023/0081078 A1, Mar. 16, 2023
Int. Cl. H01L 27/146 (2006.01); H04N 25/75 (2023.01)
CPC H01L 27/1463 (2013.01) [H01L 27/1464 (2013.01); H01L 27/14621 (2013.01); H01L 27/14623 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14641 (2013.01); H01L 27/14645 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01); H04N 25/75 (2023.01)] 20 Claims
OG exemplary drawing
 
1. An imaging device, comprising:
a substrate including a photoelectric conversion region;
a first trench and a second trench, wherein the photoelectric conversion region is disposed between the first trench and the second trench;
a first film including silicon oxide disposed above the photoelectric conversion region at a light receiving surface side of the substrate and contacting the substrate;
a second film disposed above the first film at the light receiving surface side of the substrate;
a third film disposed above the second film at the light receiving surface side of the substrate; and
a fourth film disposed above the third film at the light receiving surface side of the substrate,
wherein the second film includes at least one of a group consisting of: hafnium oxide, zirconium oxide, aluminum oxide, titanium oxide, and tantalum oxide,
wherein the third film includes at least one of the group consisting of: hafnium oxide, zirconium oxide, aluminum oxide, titanium oxide, and tantalum oxide, and
wherein the fourth film includes at least one of the group consisting of: hafnium oxide, zirconium oxide, aluminum oxide, titanium oxide, and tantalum oxide.