US 11,862,624 B2
Integrated circuit device with protective antenna diodes integrated therein
Taemin Ok, Cheonan si (KR); Inmo Kim, Hwaseong si (KR); Sujeong Kim, Seoul (KR); and Daeseok Byeon, Seongnam-si (KR)
Assigned to Samsung Electronics Co., Ltd.
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 20, 2021, as Appl. No. 17/325,821.
Claims priority of application No. 10-2020-0146195 (KR), filed on Nov. 4, 2020.
Prior Publication US 2022/0139904 A1, May 5, 2022
Int. Cl. H01L 27/02 (2006.01); H01L 23/538 (2006.01); H01L 27/06 (2006.01); H10B 41/27 (2023.01); H10B 43/27 (2023.01)
CPC H01L 27/0255 (2013.01) [H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 27/0629 (2013.01); H10B 41/27 (2023.02); H10B 43/27 (2023.02)] 18 Claims
OG exemplary drawing
 
1. An integrated circuit device, comprising:
a lower substrate;
a peripheral circuit structure comprising a plurality of antenna diodes formed in the lower substrate;
a conductive plate comprising a tile region having a rectangular shape with four vertices and an edge region surrounding the tile region, the conductive plate covering the peripheral circuit structure;
a cell array structure overlapping the peripheral circuit structure with the tile region of the conductive plate therebetween in a vertical direction; and
a plurality of bypass wiring structures connected between the plurality of antenna diodes and the conductive plate,
wherein the plurality of antenna diodes are under portions of the edge region of the conductive plate, which are respectively adjacent to four vertex portions of the tile region of the conductive plate.