CPC H01L 23/552 (2013.01) [H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 23/31 (2013.01); H01L 23/66 (2013.01); H01Q 1/2283 (2013.01)] | 25 Claims |
1. A semiconductor device, comprising:
a first package layer;
a first shielding layer formed over the first package layer, wherein the first shielding layer is patterned to form a redistribution layer;
an electrical component disposed over the redistribution layer;
an encapsulant deposited over the electrical component; and
a second shielding layer formed over the encapsulant, wherein the second shielding layer is patterned.
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