US 11,862,540 B2
Mold flow balancing for a matrix leadframe
Yh Heng, Muar (MY)
Assigned to STMicroelectronics SDN BHD, Muar (MY)
Filed by STMicroelectronics SDN BHD, Muar (MY)
Filed on Feb. 2, 2021, as Appl. No. 17/165,492.
Claims priority of provisional application 62/985,949, filed on Mar. 6, 2020.
Prior Publication US 2021/0280502 A1, Sep. 9, 2021
Int. Cl. H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/49551 (2013.01) [H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A frame, comprising:
a plurality of leadframe units arranged in a matrix, wherein each leadframe unit comprises:
a die pad; and
a plurality of tie bars connected to and extending from the die pad, wherein each tie bar includes an internal tie bar portion and an external tie bar portion, and wherein at least one tie bar of said plurality of tie bars includes a cut separating said internal tie bar portion of the at least one tie bar from the external tie bar portion of the at least one tie bar, and wherein said internal tie bar portion of the at least one tie bar includes a bend to form a bent internal tie bar portion providing a mold flow control structure;
wherein the bent internal tie bar portion extends linearly from a location of the bend in the internal tie bar portion of the at least one tie bar to a location of the cut in the at least one tie bar, and
wherein a length of the bent internal tie bar portion from the location of the bend to the location of the cut is different in each leadframe unit of said plurality of leadframe units in the frame.